LASER CUT UV
Description
The UV laser developed by LPKF, is perfect for precision cutting and working of different materials such as flexible PCBs, IC substrates, high density PCBs etc…
Very high
hole quality
Productivity
Suitable for processing
on different materials
Large work area
Laser Cut UV
LPKF MicroLine 5000 TF
Discover the whole range of our solutions of Laser Cut UV
GENERAL INFORMATION
Common applications include drilling through holes and / or blind holes, cutting coverlay, prepeg and polyamide.
Technical data
- Laser Class: 1
- Working area (X x Y x Z): 533mm x 610mm x 11mm (21 ″ x24 ″)
- Format; max reel width: 533mm x 610mm (21 ″ x 24 ″); 500mm (19.6 ″)
- Position Accuracy: +/- 20um (0.8 Mil)
- Laser beam diameter: 20um (0.8 Mil)
- Laser wavelength: 355nm
- Power supply: 400VAC, 3-PHASE, 50-60 Hz, 16 A, 6.5 kVA
- Cooling: Air-cooled (internal water-air cooling)
- Outdoor temperature: 22 ° C +/- 2 ° C
- Humidity: <60% (non-condensing)