STEEL

Fine grain steel

The high quality of the material allows the reduction of burrs and the increase of efficiency in the transfer of the dough, thanks to a finer molecular structure.
Atg offers fine grain steel sheets and coils up to 500 kg.

atg - Acciaio - Fine Grain

DESCRIPTION

This premium quality, fine-grained stainless steel material has been specially created with a finer molecular structure to meet the needs of stencils created for fine-grained components. The main advantage is the reduction of burrs and the increase of efficiency in the transfer of the dough.

Atg offers fine grain steel sheets and coils up to 500 kg.

TECHNICAL DATA

grain size: 1-2 μm

thickness: 0.08-0.25 mm

Application type: precision engravings

Semi-fine grain steel

Semi-fine grain steel alloy is used in SMT and engraving industry as it has excellent anti stress properties which prevent the deformation effect. The composition is very similar to fine grain leg, but the prices are lower.
Atg offers fine grain steel sheets and coils up to 500 kg.

atg - Acciaio Semi Fine Grain

DESCRIPTION

The high cutting speed and very low operating costs make LPKF MicroLine systems the most affordable on the market.
LPKF uses a state-of-the-art fiber laser system with customized optics and puts operator safety first. All LPKF StencilLaser systems adhere to class 1 for laser safety and have a state-of-the-art smoke and cutting residue extractor

Atg offers fine grain steel sheets and coils up to 500 kg.

TECHNICAL DATA

Grain size: 2-5 μm

Thickness: 0.08-0.40 mm

Application type: precision engravings

Nickel

Ni84 nickel alloy was created to meet the needs of the stencil manufacturing industry for photochemical engraving.

atg - nickel

DESCRIPTION

Nippon Gokin’s Ni84 nickel alloy is designed for special stencils used in SMT and semiconductor paste. This special electroformed nickel alloy was
created specifically to meet the needs of the laser and stencil production industry for photochemical engraving: the empty spaces allow the creation of fine-pitch components ideal for wafer bumping and multi-layered stencils.

TECHNICAL DATA

Tickness: 0.035 ~ 0.200 mm

Application types: laser e  incisioni fotochimiche